120-H — Reference Bath Conditions

These values are reproduced from Mengde's original 120-H product information. They describe this particular additive system and are not a universal plating formulation. Copper sulfate pentahydrate: 160–220 g/L; standard 180 g/L Sulfuric acid: 50–70 g/L; standard 60 g/L Chloride: 60–120 mg/L; standard 80 mg/L 120-H make-up additive: 4–6 mL/L; standard 5 mL/L 120-H additive A: 0.4–0.6 mL/L; standard 0.5 mL/L 120-H brightener B: 0.4–0.6 mL/L; standard 0.5 mL/L Temperature: 15–40°C; standard 20–35°C Cathode current density: 1.5–8 A/dm²; standard 3.0–5.4 A/dm² Anode: Phosphorized copper, 0.03–0.06% phosphorus Agitation: Air agitation and cathode movement Voltage: 2–10 V 120-H delivers rapid brightening and good leveling, including in low-current-density areas. The bath is stable and easy to control, and the deposit is flexible with a low tendency to form pinholes or pits. It is suitable for high-quality plastic plating, lighting components and hardware. Typical consumption: make-up additive 40–80 mL/kAh; additive A 40–80 mL/kAh; brightener B 20–50 mL/kAh. Discuss your process with the technical team before changing production conditions. Use the product's current documentation for handling and storage.