Selecting the Right Additive for Surface Finishing

Begin with the process A chemical used in a nickel bath is not automatically suitable for acid copper. Define the plating process and intended finish before comparing products. Mengde's selected portfolio includes both formulation intermediates and additive systems. Intermediates and additive systems An intermediate contributes a particular function within a formulation. PPS, for example, is described as a nickel leveling agent, while TPP treats copper and zinc impurities in nickel baths. NI-88 and 120-H are additive systems with their own source operating conditions. Match function to the requirement Consider whether the requirement concerns grain refinement, leveling, throwing power, brightening or impurity treatment. Read the product application and technical information together. Product codes alone do not establish compatibility. Review operating conditions The NI-88 source includes bath composition, temperature, pH and current-density values. The 120-H source describes a different acid copper process. These reference ranges belong to their respective systems and should not be transferred between products. Prepare a useful inquiry Include the product code, process, bath conditions, target finish and any current issue. For a sample request, describe the planned evaluation. Our team can discuss the available technical information and next steps. Source: adapted from Mengde's original NI-88, 120-H, PPS and TPP product information.