Overview
SPS refines the grain structure of copper deposits and helps prevent burning in high-current-density areas. It can be combined with acid copper dyes, nonionic surfactants, polyamines, polyethers and selected mercapto compounds. These additive systems offer a long operating life, few decomposition products and low brightener consumption.
SPS is used in decorative acid copper plating, PCB copper plating, hard copper electroforming and electrolytic copper foil production. Keep it separate from imine leveling agents when preparing concentrates, as mixing may cause cloudiness. Insufficient SPS reduces leveling and brightness and may lead to burrs or burning. Excess SPS may cause a whitish deposit or reduced brightness in low-current-density areas.
Key Benefits
- Copper grain refinement
- Helps prevent high-current-density burning
- Suitable for dye and non-dye additive systems
Applications
Technical support for your process
Tell us your application, bath conditions and requirements to discuss product selection and use.