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SURFACE FINISHING CHEMISTRY

Electroplating Intermediates

Specialty intermediates for copper, nickel and related plating processes.

7 products

Electroplating Intermediates

SPS

Bis-(sodium sulfopropyl)-disulfide

Grain refiner for acid copper plating, printed circuit boards and electrolytic copper foil.

Decorative copper platingPrinted circuit boardsHard copper electroforming
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Electroplating Intermediates

MPS

3-Mercapto-propyl sulfonic acid, sodium salt

Acid copper intermediate with strong throwing power, including at elevated temperatures.

Decorative copper platingPrinted circuit boardsElectrolytic copper foil
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Electroplating Intermediates

TPP

Super Zinc and Copper Impurity Remover

Copper and zinc impurity treatment for bright nickel, satin nickel and nickel-iron plating baths.

Bright nickel platingSatin nickel platingNickel-iron alloys
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Electroplating Intermediates

DPS

Sodium N,N-Dimethyldithiocarbamate Propane Sulfonate

Acid copper grain refiner for bright, ductile deposits in PCB and copper foil production.

Printed circuit boardsElectrolytic copper foil
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Electroplating Intermediates

H1

Tetrahydrothiazole-2-thione

Leveling brightener for acid copper and cyanide-free alkaline zinc plating.

Decorative copper platingCyanide-free alkaline zinc plating
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Electroplating Intermediates

NF-20

Chromium Mist Inhibitor

Fluorine-free mist inhibitor for decorative and hard chromium plating.

Decorative chromiumHard chromiumPlastic etching
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Electroplating Intermediates

PPS

Pyridinium Propyl Sulfobetaine

High-purity leveling agent for bright nickel, electroless nickel and nickel-iron alloy plating.

Bright acid nickelElectroless nickelNickel-iron alloys
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